H05K 9/0022
Of components mounted on printed circuit boards [pcb]
Official title: {of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)}
H05K9/0022 (Of components mounted on printed circuit boards [pcb]) appears on 1,328 US grants and 1,481 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,328
- Published applications
- 1,481
- Assignees
- 572
- Inventors
- 3,369
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 12 | 0 |
| 1996 | 11 | 0 |
| 1997 | 11 | 0 |
| 1998 | 26 | 0 |
| 1999 | 16 | 0 |
| 2000 | 24 | 0 |
| 2001 | 46 | 13 |
| 2002 | 34 | 30 |
| 2003 | 24 | 25 |
| 2004 | 25 | 33 |
| 2005 | 23 | 31 |
| 2006 | 26 | 31 |
| 2007 | 19 | 29 |
| 2008 | 16 | 32 |
| 2009 | 26 | 54 |
| 2010 | 19 | 39 |
| 2011 | 35 | 40 |
| 2012 | 24 | 43 |
| 2013 | 33 | 58 |
| 2014 | 28 | 66 |
| 2015 | 38 | 61 |
| 2016 | 55 | 54 |
| 2017 | 50 | 87 |
| 2018 | 74 | 105 |
| 2019 | 92 | 74 |
| 2020 | 88 | 100 |
| 2021 | 75 | 85 |
| 2022 | 70 | 80 |
| 2023 | 57 | 97 |
| 2024 | 71 | 89 |
| 2025 | 86 | 70 |
| 2026 | 51 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor apparatus6 Oct 2026US 12,757,364 B2Fuji Electric Co., Ltd.
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Control module for a vehicle with at least one electric motor and a transmission29 Sep 2026US 12,750,987 B2Vitesco Technologies Germany GmbH
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- Systems and methods for fastening compression-attached memory module to a circuit board29 Sep 2026US 12,750,993 B2Dell Products L. P.
- Display device1 Oct 2026US 2026/0304718 A1LG Display Co., Ltd.
- Integrated electromagnetic interference shield1 Oct 2026US 2026/0304720 A1STMicroelectronics International N. V.
- Electronic package modules with intra-module electromagnetic interference shielding1 Oct 2026US 2026/0304721 A1Skyworks Solutions, Inc.
- Method of providing intra-module electromagnetic interference shielding to an electronic package module1 Oct 2026US 2026/0304722 A1Skyworks Solutions, Inc.
- Vehicle on-board electrical device17 Sep 2026US 2026/0282304 A1Kabushiki Kaisha Toyota Jidoshokki
Most cited
By later US patents
- System and method for shielding electrical components from electromagnetic waves1,527US 6,320,123 B12001
- Heat sink and thermal interface having shielding to attenuate electromagnetic interference192US 6,483,707 B1Loctite Corporation · 2002
- Circuit board RF shielding189US 6,239,359 B1Lucent Technologies Inc. · 2001
- Conforming shielded form for electronic component assemblies145US 6,483,719 B1Spraylat Corporation · 2002
- Apparatus and method for shielding an electronic module from electromagnetic radiation143US 5,675,473 AMotorola, Inc. · 1997