Integrated electromagnetic interference shield

An apparatus comprising:

• a substrate comprising one or more ground pads at a plurality of locations of the substrate for grounding the external shield can, wherein the substrate defines one or more holes or chamfers at the respective locations;
• wherein the external shield can defines apertures of predetermined sizes corresponding to one or more optical components of an electronic device;
• and
• wherein the external shield can defines a region of a predetermined threshold minimum size between the external shield can and the cap, and wherein the region is configured to be an airgap.

A method for fabricating an external shield can, the method comprising:

• defining one or more holes or chamfers at a plurality of locations of a substrate;
• disposing one or more ground pads at the respective locations of the substrate;
• defining, on an external shield can, apertures of predetermined sizes;
• and
• coupling the external shield can to the substrate at the respective ground pads using solder such that the external shield can is externally grounded;
• wherein the substrate is coupled to an electronic device comprising at least one optical module and one or more electronic components.