Method of providing intra-module electromagnetic interference shielding to an electronic package module

A method of forming an intra-module electromagnetic interference shielding structure, the method comprising:

• providing a strip including a first electronic package module and a second electronic package module spaced from the first electronic package module by a singulation line;
• providing an electromagnetic interference shielding arrangement including a first portion over the first electronic package module and a second portion over the singulation line;
• and
• singulating the first electronic package module along the singulation line thereby fracturing the second portion while keeping the first portion with the first electronic package module to define the intra-module electromagnetic interference shielding structure.

A method of forming an intra-module electromagnetic interference shielding structure, the method comprising:

• providing a strip including a first electronic package module and a second electronic package module spaced from the first electronic package module by a singulation line;
• providing an electromagnetic interference shielding arrangement including a first portion over the first electronic package module, a second portion over the singulation line, and a third portion over the second electronic package module;
• and
• singulating the first electronic package module and the second electronic package module along the singulation line thereby fracturing the second portion while keeping the first portion with the first electronic package module to define a first intra-module electromagnetic interference shielding structure, and keeping the third portion with the second electronic package module to define a second intra-module electromagnetic interference shielding structure.