H05K 9/0029
Made from non-conductive materials intermixed with electro-conductive particles
Official title: {made from non-conductive materials intermixed with electro-conductive particles (H05K9/0031 takes precedence)}
H05K9/0029 (Made from non-conductive materials intermixed with electro-conductive particles) appears on 13 US grants and 14 published applications in this corpus.
Search patents in H05K- Granted patents
- 13
- Published applications
- 14
- Assignees
- 13
- Inventors
- 39
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 3 |
| 2004 | 1 | 3 |
| 2005 | 3 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 2 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 2 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic component module14 Jul 2026US 12,684,749 B2Murata Manufacturing Co., Ltd.
- Thermally conductive EMI suppression compositions12 Jun 2018US 9,999,158 B2Henkel IP & Holding GmbH
- Conductive elastomeric shielding device and method of forming same27 Oct 2009US 7,609,530 B2Delphi Technologies, Inc.
- Methods for making conforming shielded form for electronic component assemblies24 Mar 2009US 7,506,436 B2Spraylat Corporation
- Electromagnetic wave absorption material and an associated device3 Jul 2007US 7,239,261 B2Hitachi, Ltd.
- Electronic device28 Nov 2024US 2024/0395734 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Module15 Aug 2024US 2024/0276691 A1Murata Manufacturing Co., Ltd.
- Thermally conductive member27 Jun 2019US 2019/0195577 A1Joinset Co., Ltd.
- Thermally Conductive EMI Suppression Compositions3 Jul 2014US 2014/0182924 A1The Bergquist Company
- Electrically-conductive foam emi shield7 Jul 2011US 2011/0162879 A1Parker-Hannifin Corporation
Most cited
By later US patents
- Conforming shielded form for electronic component assemblies145US 6,483,719 B1Spraylat Corporation · 2002
- Method for shielding an electronic component94US 7,013,558 B2Spraylat Corporation · 2006
- Electromagnetic wave absorption material and an associated device78US 6,818,821 B2Hitachi, Ltd. · 2004
- Electromagnetic wave absorption material and an associated device38US 7,239,261 B2Hitachi, Ltd. · 2007
- Conductive elastomeric shielding device and method of forming same26US 7,609,530 B2Delphi Technologies, Inc. · 2009