Thermally Conductive EMI Suppression Compositions
AssigneeThe Bergquist Company
InventorsSanjay Misra, John Timmerman, Kasyap Seethamraju
Life of this patent
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Abstract
An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.
Claims22
A thermally conductive interface pad for suppressing transmission of electromagnetic radiation, said interface pad comprising a body having a first surface and a generally opposed second surface defining a thickness therebetween, said body exhibiting a thermal conductivity of at least 1 W/m·K through the thickness, a hardness of between 10-70 Shore 00 at 20° C., a volume electrical resistivity of at least 108 Ω·m, and an attenuation of at least one dB of radiation having a waveform frequency of between 1-10 GHz.
An electromagnetic interference suppression apparatus, comprising a body having a first surface and a generally opposed second surface defining a thickness therebetween, said body exhibiting a thermal conductivity of at least 1 W/m·K through the thickness, a hardness of between 10-70 Shore 00 at 20° C., and a volume electrical resistivity of at least 108 Ω·m, said body having a first portion and a second portion, said first portion including electromagnetic radiation suppression material selected from magnetic metal powders, magnetic metal alloy powders, carbon fibers, graphite, polyacrylonitrile fibers, magnetic ceramics, Mn—Zn, Ni—Zn, Fe—Co, Fe—Si, and combinations thereof.
An electromagnetic interference suppression apparatus, comprising:
- a shield member secured to a substrate and defining an enclosure;
- an electronic component mounted at said substrate within the enclosure;
- and
- an interference suppression body capable of attenuating radiation having a waveform frequency of between 1-10 GHz by at least 1 dB and exhibiting a thermal conductivity of at least 1 W/m·K, a hardness of between 10-70 Shore 00 at 20° C., and a volume electrical resistivity of at least 108 Ω·m, said interference suppression body being disposed in the enclosure between said electronic component and said shield member.
An electromagnetic interference suppression apparatus, comprising a body having a first surface and a generally opposed second surface defining a thickness therebetween, said body including a first portion and a second portion, said first portion including electromagnetic radiation suppression material dispersed in a polymer matrix, said electromagnetic radiation suppression material being selected from magnetic metal powders, magnetic metal alloy powders, carbon fibers, graphite, polyacrylonitrile fibers, magnetic ceramics, Mn—Zn, Ni—Zn, Fe—Co, Fe—Si, and combinations thereof, said first portion being spaced from at least one of said first and second surfaces and having a hardness of between 10-70 Shore 00 at 20° C., said second portion being coextensive with at least one of said first and second surfaces, and having a hardness of between 10-70 Shore 00 at 20° C.
Dependencies are inferred from the claim text.