Electronic component module

Abstract

A module includes a substrate, a first component, a sealing resin, and a shield film. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component is provided with an exposed surface. The exposed surface is exposed through the sealing resin on a side opposite to the substrate. The shield film is made of metal and covers the first component and the sealing resin. The shield film is provided with a first contact portion. The first contact portion is in contact with the exposed surface. The first contact portion includes a layer formed from a plurality of crystal grains. The plurality of crystal grains are different in longitudinal direction from one another when they are viewed from a direction orthogonal to the first surface.

Dependencies are inferred from the claim text.