Electrically-conductive foam emi shield

An EMI shield having at least on compartment for enclosing circuitry of an electronic device, the shield comprising a resilient layer of a thermoformable, electrically-conductive foam, the layer having first surface and a second surface defining a thickness dimension therebetween, and the layer having an interior portion surrounded by a perimeter portion, the interior portion of the layer being compressed through the thickness dimension thereof to form a top wall portion of the shield, the thickness dimension of the perimeter portion extending downwardly from the top wall portion to form a side wall portion of the shield which together with the top wall portion defines at least a portion of the compartment.

An assembly for the EMI shielding of circuitry of an electronic device, the assembly comprising:

• an EMI shield having at least one compartment, the shield comprising a resilient layer of a thermoformable, electrically-conductive foam, the layer having first surface and a second surface defining a thickness dimension therebetween, and the layer having an interior portion surrounded by a perimeter portion the interior portion of the layer being compressed through the thickness dimension thereof to form a top wall portion of the shield, the thickness dimension of the perimeter portion extending downwardly from the top wall portion to form a side wall portion of the shield which together with the top wall portion defines at least a portion of the compartment, the compartment being received over the circuitry of the device.