Methods for making conforming shielded form for electronic component assemblies
AssigneeSpraylat Corporation
InventorBruce Bachman
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Abstract
The present invention provides a method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of: (a) metalizing a sheet of a thermoformable polymer with an admixture of a conductive metal and a resin; and (b) thermoforming the metalized thermoformable polymer from step (a) to form a conforming shield enclosure; wherein the conforming shield enclosure has dimensions conforming to the inside of a housing of the electronic component assembly and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization.
Claims18
A method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of:
- (a) metalizing a sheet of a thermoformable polymer with an admixture of a conductive metal and a resin;
- wherein the conductive metal is selected from the group consisting of metalized thermoformable polymer comprises metal particles selected from the group consisting of copper, silver, cobalt, titanates, niobates, zirconates, nickel, gold, tin, aluminum, magnesium, and alloys thereof, and
- (b) thermoforming the metalized thermoformable polymer from step (a) to form a conforming shield enclosure;
- wherein the conforming shield enclosure has dimensions conforming to the inside of a housing of the electronic component assembly and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization, and further comprising the step of metalizing the conforming shield enclosure from step (b) with an admixture of a second conductive metal and a resin.
A method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of:
- (a) thermoforming a sheet of a thermoformable polymer to form a conforming enclosure;
- and
- (b) metalizing the thermoformed polymer from step (a) with an admixture of a conductive metal and a resin to form a conforming shield enclosure;
- wherein the conforming shield enclosure has dimensions conforming to the inside of a housing of the electronic component assembly and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization.
Dependencies are inferred from the claim text.