H05K 9/0031
Combining different shielding materials
Official title: {combining different shielding materials}
H05K9/0031 (Combining different shielding materials) appears on 45 US grants and 53 published applications in this corpus.
Search patents in H05K- Granted patents
- 45
- Published applications
- 53
- Assignees
- 25
- Inventors
- 128
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 2 |
| 2006 | 1 | 3 |
| 2007 | 2 | 3 |
| 2008 | 1 | 0 |
| 2009 | 2 | 1 |
| 2010 | 1 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 2 | 2 |
| 2016 | 4 | 5 |
| 2017 | 0 | 2 |
| 2018 | 2 | 7 |
| 2019 | 7 | 1 |
| 2020 | 2 | 3 |
| 2021 | 2 | 4 |
| 2022 | 3 | 2 |
| 2023 | 2 | 5 |
| 2024 | 2 | 2 |
| 2025 | 5 | 1 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power module and solid-state transformer system9 Jun 2026US 12,651,696 B2Delta Electronics (Shanghai) Co., Ltd.
- Electronic device24 Mar 2026US RE50,841 E1Samsung Electronics Co., Ltd.
- Thermally dissipative electromagnetic interference shield or cover for an electronic device2 Dec 2025US 12,490,416 B2BAE Systems Information and Electronic Systems Integration Inc.
- Electromagnetic wave attenuator and electronic device18 Nov 2025US 12,476,341 B2Kabushiki Kaisha Toshiba
- Compartmentalized shielding of a module utilizing self-shielded sub-modules24 Jun 2025US 12,342,518 B2Qorvo US, Inc.
- Shield structure and electronic device6 Aug 2026US 2026/0231383 A1
- Compartmentalized shielding of a module utilizing self-shielded sub-modules28 Aug 2025US 2025/0275107 A1Qorvo US, Inc.
- Thermally dissipative electromagnetic interference shield or cover for an electronic device13 Jun 2024US 2024/0196578 A1BAE Systems Information and Electronic Systems Integration Inc.
- Method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board and electromagnetic shield housing6 Jun 2024US 2024/0188264 A1Rohde & Schwarz GmbH & Co.KG
- Compartmentalized shielding of a module utilizing self-shielded sub-modules3 Aug 2023US 2023/0247814 A1Qorvo US, Inc.
Most cited
By later US patents
- Electromagnetic wave absorption material and an associated device78US 6,818,821 B2Hitachi, Ltd. · 2004
- EMI absorbing shielding for a printed circuit board43US 7,129,422 B2Wavezero, Inc. · 2006
- Electromagnetic wave absorption material and an associated device38US 7,239,261 B2Hitachi, Ltd. · 2007
- Combined board level EMI shielding and thermal management36US 7,262,369 B1Laird Technologies, Inc. · 2007
- Cover member for sealed circuit board assembly28US 5,867,371 AEricsson Inc. · 1999