Electronic device

A method for assembling an electronic device, the method comprising:

• creating a substrate including an electric element mounted thereon;
• disposing a shield can including at least one first opening at a part facing the electric element on the substrate;
• disposing a shielding member to cover a first surface of the shield can, the shielding member being compressed when being pressed, and including at least one second opening for discharging heat from the electric element, and a shielding film engaged with an exterior of the shielding member;
• disposing a metal plate to cover a first surface of the shielding member, mounting a heat conductive member on a first surface of the metal plate, mounting an insulation film on a second surface opposite to the first surface of the metal plate, and disposing the heat conductive member to face a first surface of the electric element, in engagement with the at least one first and second openings;
• and
• mounting the metal plate on a first surface of the insulation film, and mounting at least one cooling member on a second surface opposite to the first surface of the insulation film,
• wherein the insulation film transfers heat from the heat conductive member to the at least one cooling member through the metal plate,
• wherein the at least one cooling member comprises a first cooling member and a second cooling member,
• wherein the first cooling member includes a heat pipe engaged with the insulation film included in the electronic device, for receiving heat generated from the electric element through the metal plate and the heat conductive member, and cooling the received heat, and
• wherein the second cooling member includes a bracket engaged with the first cooling member, while being supported by the first cooling member, for absorbing and dissipating the heat of the first cooling member.