Cover member for sealed circuit board assembly
AssigneeEricsson Inc.
InventorsQuentin S. Denzene, Edwin J. Nealis
Life of this patent
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Abstract
A multi-layered laminate structure forms a cover member that is capable of being sealed around the edges of a circuit board, around connector assemblies mounted on the circuit board, and against a mounting panel to which the circuit board is attached, to provide a sealed environment for electrical components mounted on the circuit board.
Claims16
A cover member adapted for sealing one side of a circuit board defined by edges that include a first edge adapted for mounting to a face panel and at least one connector assembly disposed on a peripheral margin of said one side of the circuit board at a position adjacent another edge of the circuit board, said connector assembly having an outer surface portion spaced from said one side of the circuit board, said cover member comprising:
- a substantially rigid multilayered laminate structure having a first layer formed of an electrically nonconductive polymer adapted for bonding with preselected portions of said circuit board, a second layer formed of a material having electromagnetic radiation shielding properties and bonded to said first layer, a third layer formed of an electrically nonconductive polymer bonded to said second layer, and a fourth layer formed of an electrically conductive material and bonded to said third layer;
- a first portion of said laminate structure adapted to sealingly surround said outer surface portion of connector assembly;
- and
- an edge portion of said laminate structure adapted to sealingly abut said face panel.
A cover member adapted for sealing one side of a circuit board defined by edges that include a first edge adapted for mounting to a face panel and at least one connector assembly disposed on said first edge of the circuit board at a position adjacent said face panel, said cover member comprising:
- a substantially rigid multilayered laminate structure having a first layer formed of an electrically nonconductive polymer adapted for bonding with preselected portions of said circuit board, a second layer formed of a material having electromagnetic radiation shielding properties and bonded to said first layer, a third layer formed of an electrically nonconductive polymer bonded to said second layer, and a fourth layer formed of an electrically conductive material and bonded to said third layer, said multilayered laminate structure having an edge portion adapted to protectively surround a portion of said connector assembly and sealingly abut said face panel.
A sealed circuit board assembly, comprising:
- a panel adapted to receive a circuit board;
- a circuit board attached to said panel and having a plurality of electrical components mounted on a surface of the circuit board, said surface being defined by edges with substantially planar margins disposed adjacent first defined portions of the edges, and at least one electrical connector assembly mounted on a planar margin of said surface disposed adjacent a second defined portion of a preselected one of said edges of the circuit board, said connector assembly having an outer surface portion spaced from said surface of the circuit board;
- a cover member having a multilayered laminate structure comprising a first layer formed of an electrically nonconductive polymer having portions thereof bonded to said planar margins adjacent the first defined portions of the edges of the circuit board, a second layer formed of a material having electromagnetic radiation shielding properties bonded to said first layer, a third layer formed of an electrically nonconductive polymer bonded to said second layer, and a fourth layer formed of an electrically conductive material bonded to said third layer, a first portion adapted to sealingly surround said outer surface portion of the connector assembly;
- and an edge portion adapted to sealingly abut said panel.
Dependencies are inferred from the claim text.