Back to results
US 7,129,422 B2Granted
EMI absorbing shielding for a printed circuit board
AssigneeWavezero, Inc.
InventorRocky R. Arnold
Life of this patent
Estimating the term…
Abstract
The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.
Claims11
An EMI shield comprising:
- a shield body comprising a EMI reflecting conductive layer coupled to a polymer substrate;
- an EMI absorbing material coupled to the conductive layer of the shield body, the EMI absorbing material, comprising:
- a surface resistivity conductive layer that has surface resistivity higher than the conductive layer;
- and
- a metal layer that is disposed on an open-celled skeletal structure.
2 more elements
An EMI shield comprising:
- a shield body comprising a conductive layer coupled to a polymer substrate, wherein the conductive layer has a sufficient thickness to reflect EMI;
- an EMI absorbing material electrically coupled to the conductive layer, wherein the EMI absorbing material comprises a higher permeability and permittivity than the conductive layer;
- and
- a substrate having an open-celled skeletal structure and a conductive metal layer deposited on at least a portion of the open-celled skeletal structure.
1 more element
Dependencies are inferred from the claim text.