Wavezero, Inc.
Sunnyvale, CA, US· latest recorded location
Wavezero, Inc. is named on 12 US grants and 18 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 12
- Published applications
- 18
- Inventors
- 9
- Granted in 2026 so far
- 0
- Most recent grant
- 10 Feb 2009
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 2 | 3 |
| 2005 | 1 | 4 |
| 2006 | 3 | 6 |
| 2007 | 1 | 4 |
| 2008 | 4 | 0 |
| 2009 | 1 | 0 |
By publication year.
Technology areas
Share of 30 documents
- H05KPrinted circuits19
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by10
- Y10TTechnical subjects covered by former us classification9
- C23CCoating metallic material6
- H01RElectrically-conductive connections6
- B29CShaping or joining of plastics4
- B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding4
- G06KGraphical data reading4
- H01QAntennas, i.e. radio aerials3
- B29LIndexing scheme associated with subclass b29c, relating to particular articles2
Recent patents
- EMI absorbing shielding for a printed circuit board10 Feb 2009US 7,488,901 B2
- Electromagnetic interference shielding for a printed circuit board28 Oct 2008US 7,443,693 B2
- Electromagnetic interference shielding of electrical cables and connectors19 Aug 2008US 7,414,197 B2
- Radiofrequency antennae and identification tags and methods of manufacturing radiofrequency antennae and radiofrequency identification tags20 May 2008US 7,374,102 B2
- Electromagnetic interference shields for electronic devices15 Apr 2008US 7,358,447 B2
- System and Method for Attaching Radiofrequency Identification Chips to Metalized Antenna6 Dec 2007US 2007/0279230 A1
- Solderable Plastic EMI Shielding15 Nov 2007US 2007/0264496 A1
- RFID Smart Label with Reduced Layers and Method of Production13 Sep 2007US 2007/0210924 A1
- Electromagnetic Interference Shields for Electronic Devices30 Aug 2007US 2007/0199738 A1
- Emi absorbing shielding for a printed circuit board7 Dec 2006US 2006/0272856 A1
Most cited
By later US patents
- Electromagnetic interference shielding for a printed circuit board75US 7,443,693 B22008
- Multi-layered structures and methods for manufacturing the multi-layered structures50US 6,768,654 B22004
- EMI shielding for electronic component packaging50US 7,109,410 B22006
- EMI absorbing shielding for a printed circuit board43US 7,129,422 B22006
- EMI absorbing shielding for a printed circuit board28US 7,488,901 B22009