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US 2007/0199738 A1Published application
Electromagnetic Interference Shields for Electronic Devices
AssigneeWavezero, Inc.
InventorJohn Gabower
Life of this patent
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Abstract
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
Claims15
An EMI/RFI shielding device comprising:
- a shaped polymer substrate comprised of metallized polymer substrate, wherein the shaped polymer substrate is substantially conductive;
- and
- a conductive material on at least one surface of the shaped polymer substrate.
An EMI/RFI shield comprising:
- a thermoformed thin-walled shape formed of a recycled metallized polymeric material, wherein the thermoformed thin-walled shape comprises an inner surface, an outer surface and edges;
- and
- a conductive material deposited on at least one of the inner surface and outer surface, wherein the conductive coating comprises a substantially even thickness between 1 micron to 50 microns.
Dependencies are inferred from the claim text.