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US 7,358,447 B2Granted
Electromagnetic interference shields for electronic devices
AssigneeWavezero, Inc.
InventorJohn F. Gabower
Life of this patent
Estimating the term…
Abstract
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
Claims12
An EMI/RFI shielding device comprising:
- a shaped polymer substrate comprised of a metallized polymer substrate and a first surface that has been modified to increase surface tension of the shaped polymer substrate;
- wherein the shaped polymer substrate is substantially conductive;
- a conductive material on at least the first surface of the shaped polymer substrate that has been modified to increase surface tension of the shaped polymer substrate;
- wherein the shaped polymer substrate comprises polyvinyl chloride, polycarbonate, polybutylene terephthalate, or polyethylene terephthalate glycol;
- and
- wherein the shaped polymer substrate is shaped to have an enclosure for enclosing an electronic component.
3 more elements
An EMI/RFI shielding device comprising:
- a shaped polymer substrate comprised of a metallized polymer substrate, wherein the shaped polymer substrate is substantially conductive;
- a conductive material on at least one surface of the shaped polymer substrate;
- wherein the shaped polymer substrate comprises:
- a first surface;
- a plurality of sidewalls that comprise a first end and a second end, wherein a first end of each of the sidewalls are coupled to the first surface, wherein the sidewalls extend at an angle from the first surface, wherein the first surface and sidewalls define an enclosure portion;
- a peripheral flange coupled to the second end of the sidewalls that extends around the enclosure portion;
- wherein the shaped polymer substrate is shaped to have an enclosure for enclosing an electronic component;
- and
- wherein at least one surface of the shaped polymer substrate has been modified to increase surface tension of the shaped polymer substrate.
6 more elements
An EMI/RFI shield comprising:
- a thermoformed thin-walled shape formed of a recycled metallized polymeric material, wherein the thermoformed thin-walled shape comprises an inner surface, an outer surface and edges, and wherein the polymeric material comprises polyvinyl chloride, polycarbonate, polybutylene terephthalate, or polyethylene terephthalate glycol, and wherein the polymeric material is shaped to have an enclosure for enclosing an electronic component, and wherein at least one surface of the shaped polymer substrate has been modified to increase surface tension of the shaped polymer substrate;
- and
- a conductive material deposited on at least one of the inner surface and outer surface, wherein the conductive coating comprises a substantially even thickness between 1 micron to 50 microns.
An EMI/RFI shield comprising:
- a thermoformed thin-walled shape formed of a recycled metallized polymeric material, wherein the thermoformed thin-walled shape comprises:
- an inner surface, an outer surface and edges;
- a first surface;
- a plurality of sidewalls that comprise a first end and a second end, wherein a first end is coupled to the first surface, wherein the sidewalls extend at an angle from the first surface, wherein the first surface and sidewalls define an enclosure portion;
- a peripheral flange coupled to the second end of the sidewalls that extends around the enclosure portion;
- a conductive material deposited on at least one of the inner surface and outer surface, wherein the conductive coating comprises a substantially even thickness between 1 micron to 50 microns;
- wherein the polymeric material is shaped to have an enclosure for enclosing an electronic component;
- and
- wherein at least one surface of the shaped polymer material has been modified to increase surface tension of the shaped polymer substrate.
6 more elements
Dependencies are inferred from the claim text.