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US 2006/0272856 A1Published application
Emi absorbing shielding for a printed circuit board
AssigneeWavezero, Inc.
InventorRocky Arnold
Life of this patent
Estimating the term…
Abstract
The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.
Claims42
An EMI shield comprising:
- a shield body comprising a conductive layer coupled to a polymer substrate;
- a polymer layer coupled to the conductive layer;
- and
- an EMI absorbing material coupled to the polymer layer.
1 more element
An EMI shield comprising:
- a polymer substrate comprising a first surface and a second surface;
- a conductive layer coupled to the first surface of the polymer substrate, wherein the conductive layer has a sufficiently high thickness and sufficient resistivity to reflect EMI;
- and
- an EMI absorbing material coupled to a second surface of the polymer substrate, wherein the EMI absorbing material comprise a high permittivity and permeability so as to absorb EMI.
1 more element
An EMI shield comprising:
- a first conductive layer coupled to a first polymer substrate;
- a second conductive layer coupled to a second polymer substrate;
- and
- an EMI absorbing material positioned in between the first polymer substrate and the second polymer substrate and electrically coupled to the first conductive layer and the second conductive layer.
1 more element
Dependencies are inferred from the claim text.