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US 7,488,901 B2Granted
EMI absorbing shielding for a printed circuit board
AssigneeWavezero, Inc.
InventorRocky R. Arnold
Life of this patent
Estimating the term…
Abstract
The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.
Claims16
An EMI shield comprising:
- a shield body comprising a conductive layer coupled to a polymer substrate;
- a polymer layer coupled to the conductive layer;
- an EMI absorbing material coupled to the polymer layer
- wherein the EMI absorbing material comprises an open-celled skeletal structure and the open-celled skeletal structure comprises a reticulated foam;
- and
- wherein the reticulated foam comprises a metal layer on all interior surfaces and on all exterior surfaces except a lower surface that is configured to be in contact with at least one of a printed circuit board, an electronic component, or traces on the printed circuit board.
3 more elements
Dependencies are inferred from the claim text.