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US 7,109,410 B2Granted
EMI shielding for electronic component packaging
AssigneeWavezero, Inc.
InventorsRocky R. Arnold, John C. Zarganis, Fabrizio Montauti
Life of this patent
Estimating the term…
Abstract
The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.
Claims33
A shielded electronic package comprising:
- a die;
- a substrate comprising a plurality of traces;
- a plurality of leads that electrically couple an active surface of the die to the plurality of traces in the substrate;
- external solder ball contacts coupled to the traces in the substrate, wherein the solder ball contacts extend from a surface of the substrate and are configured to be coupled to conductive leads on a printed circuit board;
- a conductively coated polymer shield that defines a cavity around at least a portion of the die and the plurality of leads, wherein the conductively coated polymer shield is electrically coupleable to a ground trace;
- and
- an insulative conformal coating disposed over the conductively coated polymer shield so as to encapsulate the die and plurality of leads, wherein the insulative conformal coating leaves the external solder ball contacts exposed.
4 more elements
A shielded package comprising:
- a die comprising an active surface;
- a substrate comprising a plurality of traces;
- a plurality of leads that electrically couple the active surface of the die to the plurality of traces in the substrate;
- external contacts coupled to the traces in the substrate, wherein the external contacts are configured to be coupled to conductive leads on a printed circuit board;
- a conductively coated polymer shield that defines a cavity around at least a portion of the die, wherein the conductively coated polymer shield is electrically coupleable to a ground trace in the substrate;
- a filler material disposed within the cavity defined by the conductively coated polymer shield;
- and
- a conformal coating disposed over the conductively coated polymer shield so as to encapsulate the die and plurality of leads, wherein the insulative conformal coating leaves the external solder ball contacts exposed.
5 more elements
A method of manufacturing a shielded package comprising:
- providing a substrate comprising a plurality of leads;
- electrically coupling an active face of a die to the plurality of leads;
- coupling a conductively coated resin layer to the substrate so that the die is positioned in a cavity between the substrate and the conductively coated resin layer;
- grounding the conductively coated resin layer;
- and
- applying a conformal coating over at least a portion of the conductively coated resin layer so as to encapsulate the die and at least a portion of the substrate.
3 more elements
Dependencies are inferred from the claim text.