Multi-layered structures and methods for manufacturing the multi-layered structures
AssigneeWavezero, Inc.
InventorsRocky R. Arnold, John Zarganis, Steve Toyama
Life of this patent
Estimating the term…
Abstract
Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.
Claims10
A shielded plastic housing for an electronic component, the housing comprising:
- an injection molded layer;
- a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is coupled to the injection molded layer;
- and
- a decorative layer coupled to one of the injection molded layer, the thermoform layer and the metal layer.
A method of shielding an electronic component of a printed circuit board, the method comprising:
- providing a printed circuit board having an electronic component and a ground trace;
- placing a housing comprising a metal shielding layer around the electronic component;
- and
- creating a via through a portion of the housing;
- positioning the via over the ground trace;
- and
- depositing at least one of a conductive adhesive and a solder in the via to conductively ground the metal layer in the housing to the ground trace.
A method of shielding an electronic component of a printed circuit board, the method comprising:
- providing a printed circuit board having an electronic component and a ground trace;
- placing a shield that comprises a conductive layer around the electronic component;
- creating a via through a portion of the shield;
- positioning the via over the ground trace;
- and
- depositing a conductive element in the via to conductively ground the conductive layer in the shield to the ground trace.
A shielded plastic housing for an electronic component, the housing comprising:
- a substantially rigid injection molded layer;
- a thermoform insert comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform insert is coupled to the injection molded layer;
- and
- a decorative layer selectively applied to at least a portion of one of the injection molded layer, the thermoform layer, and the metal layer, wherein the decorative layer has a thickness that is less than a thickness of the injection molded layer.
Dependencies are inferred from the claim text.