Combined board level EMI shielding and thermal management

An apparatus for providing board level EMI shielding and dissipating heat from one or more electrical components of a board, the apparatus comprising:

• a single-piece board level shield comprising a metal material and two or more portions of differing recessed depths;
• and
• at least one resiliently compressible EMI gasket disposed on the shield, the EMI gasket defining walls that are formed entirely by the EMI gasket and are of varying depth corresponding to the differing recessed depths, which walls extend below the single-piece board level shield and that define the periphery of a plurality of individual EMI shielding compartments cooperatively defined by the walls and the single-piece board level shield, wherein the plurality of individual EMI shielding compartments include a top surface defined by the single-piece board level shield, and sidewalls that define the periphery of each EMI shielding compartment formed to have corresponding differing recessed depths, whereby the EMI gasket and the single-piece board level shield cooperatively provide EMI shielding for each EMI shielding compartment to thereby inhibit the ingress and egress of EMI into and out of each EMI shielding compartment.