Method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board and electromagnetic shield housing
AssigneeRohde & Schwarz GmbH & Co. KG
InventorSimon Pippers
Life of this patent
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Abstract
A method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board comprises providing a metallic lid with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board; filling the shielding chamber with an RF-absorber material; and removing RF-absorber material from the shielding chamber until the electronic component fits into the shielding chamber while a ceiling and lateral walls of the shielding chamber remain covered with RF-absorber material.
Claims20
A method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board, the method comprising:
- providing a metallic lid with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board;
- filling the shielding chamber with an RF-absorber material;
- and
- removing RF-absorber material from the shielding chamber until the electronic component fits into the shielding chamber while a ceiling and lateral walls of the shielding chamber remain covered with RF-absorber material.
An electromagnetic shield housing for shielding an electronic component on a printed circuit board, the electromagnetic shield housing comprising:
- a metallic lid configured with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board, wherein the shielding chamber comprises a ceiling and lateral walls covered with RF-absorber material.
Dependencies are inferred from the claim text.