Thermally dissipative electromagnetic interference shield or cover for an electronic device

A cover for electrical components to shield against electromagnetic interference and dissipative transfer of heat, the cover comprising:

• a first layer formed from electrically conductive and thermally dissipative material, the first layer having a first surface and a second surface;
• a second layer formed from nonconductive material, wherein the second layer has a first surface and a second surface, and the first surface of the second layer directly interfaces with the second surface of the first layer;
• a third layer formed from electrically conductive and thermally dissipative material, wherein the third layer has a first surface and a second surface, and the first surface of the third layer directly interfaces with the second surface of the second layer;
• a fourth layer formed from nonconductive material, wherein the fourth layer has a first surface and a second surface, and the first surface of the fourth layer directly interfaces with the second surface of the third layer;
• at least one via extending through the second layer that connects the first layer to the third layer;
• a total density summed from all layers that is less than 2.7 g/cm3;
• wherein the cover is adapted to be coupled to a circuit card to dissipate heat from electrical components on the circuit card and simultaneously shield the circuit card from electromagnetic interference.

A method of manufacture of a cover for electrical components to shield against electromagnetic interference and dissipative transfer of heat, the method comprising:

• forming a first layer of electrically conductive and thermally dissipative material, the first layer having a first surface and a second surface, and the first layer including an outer portion defining an aperture and a patch disposed within the aperture;
• forming a second layer of nonconductive material, wherein the second layer has a first surface and a second surface;
• interfacing the first surface of the second layer directly with the second surface of the first layer;
• forming a third layer of electrically conductive and thermally dissipative material, wherein the third layer has a first surface and a second surface;
• interfacing the first surface of the third layer directly with the second surface of the second layer;
• forming a fourth layer of nonconductive material, wherein the fourth layer has a first surface and a second surface;
• interfacing the first surface of the fourth layer directly with the second surface of the third layer;
• connecting, conductively, the first layer to the third layer by extending at least one via through the second layer;
• wherein a total density summed from all layers that is less than 2.7 g/cm3, and wherein the cover is adapted to be coupled to a circuit card to dissipate heat from electrical components on the circuit card and simultaneously shield the circuit card from electromagnetic interference.