Electronic device comprising heat dissipation structure providing heat transfer path

An electronic device comprising:

• a board;
• an electrical component disposed on the board and configured to emit heat during operation of the electronic device;
• a shield can disposed on the board, surrounding at least a portion of the electrical component, and including an opening region formed on a side wall;
• a cooling region spaced from the shield can and configured to absorb the heat;
• and
• a heat dissipation structure comprising a heat dissipation material including a thermally conductive material having viscosity therein, disposed at least partially within the shield can through the opening region, and extending from the shield can to the cooling region;
• wherein the thermally conductive material extends from an end of the heat dissipation structure to contact a surface of the electrical component, and extends from another end of the heat dissipation structure to be disposed in the cooling region.