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US 2026/0271252 A1Published application
Radio-frequency/electromagnetic shielding for system-in-package
AssigneeMeta Platforms Technologies, LLC
InventorsSeyed Yahya Mortazavi, Kinshuk Raizada, Yuen Hui Chee
Life of this patent
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Abstract
A device of the subject technology includes a radiofrequency (RF) circuit enclosed within a shielding and an RF cage partially enclosing components of the RF circuit. The RF cage is configured to protect RF components of the RF circuit against an electromagnetic interference (EMI) caused by the components. The RF cage is partially embedded within a printed circuit board (PCB), and the RF circuit is mounted on the PCB via a number of ball grid arrays (BGAs).
Claims20
A device, comprising:
- a radiofrequency (RF) circuit enclosed within a shielding;
- and
- an RF cage partially enclosing a plurality of components of the RF circuit and configured to protect RF components of the RF circuit against an electromagnetic interference (EMI) caused by the plurality of components,
- wherein:
- the RF cage is partially embedded within a printed circuit board (PCB);
- and
- the RF circuit is mounted on the PCB via a plurality of ball grid arrays (BGAs).
4 more elements
A device, comprising:
- an RF circuit enclosed within a shielding;
- and
- an RF cage configured to protect one or more RF components of the RF circuit against EMI caused by an at least one component of the RF circuit,
- wherein:
- the RF cage is configured to enclose the at least one component of the RF circuit;
- the RF circuit is configured to be mounted on a PCB using a plurality of BGAs;
- and
- the shielding, the RF circuit and the RF cage are configured to be independent from the PCB.
5 more elements
A method, comprising:
- enclosing an RF SIP within a conformal shielding;
- and
- protecting RF components of the RF SIP against an EMI caused by a plurality of components of the RF SIP using an RF cage,
- wherein:
- using the RF cage comprises enclosing the plurality of components of the RF SIP by the RF cage to protect the RF components against EMI generated by the plurality of components;
- and
- the RF SIP is mounted on a PCB using a plurality of BGAs.
4 more elements
Dependencies are inferred from the claim text.