H05K 9/003
Made from non-conductive materials comprising an electro-conductive coating
Official title: {made from non-conductive materials comprising an electro-conductive coating (H05K9/0031 takes precedence)}
H05K9/003 (Made from non-conductive materials comprising an electro-conductive coating) appears on 65 US grants and 62 published applications in this corpus.
Search patents in H05K- Granted patents
- 65
- Published applications
- 62
- Assignees
- 50
- Inventors
- 165
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 0 |
| 2002 | 3 | 2 |
| 2003 | 1 | 2 |
| 2004 | 4 | 5 |
| 2005 | 1 | 2 |
| 2006 | 4 | 6 |
| 2007 | 1 | 0 |
| 2008 | 2 | 0 |
| 2009 | 2 | 6 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 3 |
| 2014 | 3 | 0 |
| 2015 | 2 | 2 |
| 2016 | 1 | 2 |
| 2017 | 3 | 0 |
| 2018 | 3 | 8 |
| 2019 | 8 | 1 |
| 2020 | 1 | 4 |
| 2021 | 1 | 1 |
| 2022 | 1 | 4 |
| 2023 | 3 | 8 |
| 2024 | 4 | 2 |
| 2025 | 2 | 1 |
| 2026 | 4 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power module and solid-state transformer system9 Jun 2026US 12,651,696 B2Delta Electronics (Shanghai) Co., Ltd.
- Cover plate for electronic device and electronic device comprising same19 May 2026US 12,635,094 B2Samsung Electronics Co., Ltd.
- Electromagnetic absorbing composites12 May 2026US 12,628,321 B23M Innovative Properties Company
- Structure for electromagnetic interference (EMI) shielding17 Feb 2026US 12,557,256 B2QUALCOMM Incorporated
- Electronic component module and method of manufacturing electronic component module10 Jun 2025US 12,328,857 B2Murata Manufacturing Co., Ltd.
- Housing with shielding for electromagnetic radiation13 Feb 2025US 2025/0056775 A1Continental Autonomous Mobility Germany GmbH
- Structure for electromagnetic interference (emi) shielding27 Jun 2024US 2024/0215213 A1QUALCOMM Incorporated
- Electromagnetic absorbing composites21 Mar 2024US 2024/0098950 A13M Innovative Properties Company
- Cover plate for electronic device and electronic device comprising same2 Nov 2023US 2023/0354538 A1Samsung Electronics Co., Ltd.
- Shield enclosures for memory modules13 Jul 2023US 2023/0221898 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents
- Conforming shielded form for electronic component assemblies145US 6,483,719 B1Spraylat Corporation · 2002
- Gel structure for combined EMI shielding and thermal control of microelectronic assemblies133US 6,195,267 B1Ericsson Inc. · 2001
- Shieled enclosure for electronics102US 5,566,055 AParker-Hannifin Corporation · 1996
- Method for shielding an electronic component94US 7,013,558 B2Spraylat Corporation · 2006
- EMI containment apparatus75US 6,624,432 B1Shielding for Electronics, Inc. · 2003