Electronic component module and method of manufacturing electronic component module

An electronic component module comprising:

• a substrate having a first main surface;
• an electronic component including a housing having an outer surface with an insulation property, at least a first external electrode arranged on the outer surface of the housing, and a second external electrode, the electronic component being mounted on the first main surface of the substrate;
• a sealing resin having an insulation property and covering the electronic component and the first main surface side of the substrate;
• a conductive film covering an outer surface of the sealing resin;
• and
• a conductive auxiliary layer provided on a side of the electronic component opposite to the substrate in a normal direction of the first main surface, and covering a part of the first external electrode and being not connected to the second external electrode, wherein:
• the sealing resin has a recessed portion exposing the conductive auxiliary layer,
• the conductive film has a conductive portion provided in the recessed portion, the conductive portion being connected to the conductive auxiliary layer,
• the housing has a top surface and a side surface orthogonal to the top surface, and
• the conductive auxiliary layer is positioned so as to go around the side surface of the housing from the top surface.