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US 12,557,256 B2Granted
Structure for electromagnetic interference (EMI) shielding
AssigneeQUALCOMM Incorporated
InventorsJordan Szabo, Emmanuel Howlin Pun, Ernest Soto, Tanhua Tian
Life of this patent
Estimating the term…
Abstract
Disclosed are apparatuses and techniques for fabricating apparatuses used as test platforms and commercial devices. In an aspect, an apparatus includes a non-conductive frame and a first shield structure. The first shield structure is part of the non-conductive frame. The first shield structure includes a first laser-activated surface structure, a first base metal disposed on the first laser-activated surface structure, and a first plating metal disposed on the first base metal.
Claims22
An apparatus comprising:
- a non-conductive frame;
- and
- a first shield structure, wherein the first shield structure is part of the non-conductive frame and wherein the first shield structure includes:
- a first laser-activated surface structure;
- a first base metal disposed on the first laser-activated surface structure;
- a first plating metal disposed on the first base metal
- a second shield structure, wherein the second shield structure is part of the non-conductive frame and wherein the second shield structure includes:
- a second laser-activated surface structure;
- a second base metal disposed on the second laser-activated surface structure;
- and
- a second plating metal disposed on the second base metal;
- a baseband circuit card assembly (CCA) coupled to the first shield structure by a first conductive gasket and to the second shield structure by a second conductive gasket;
- a first circuit card assembly (CCA) coupled to the first shield structure by a third conductive gasket;
- and
- a second CCA coupled to the second shield structure by a fourth conductive gasket,
- wherein the baseband CCA is disposed on a bottom side of the non-conductive frame and wherein the first CCA and the second CCA are disposed on a top side of the non-conductive frame, opposite the bottom side,
- wherein the first shield structure is covered with the first base metal and the first plating metal, and
- wherein the first shield structure has a plurality of bumps on at least one surface.
15 more elements
A method for fabricating an apparatus comprising:
- forming a non-conductive frame;
- and
- forming a first shield structure, wherein the first shield structure is part of the non-conductive frame and wherein forming the first shield structure includes:
- forming a first laser-activated surface structure;
- forming a first base metal on the first laser-activated surface structure;
- and
- forming a first plating metal disposed on the first base metal
- forming a second shield structure, wherein the second shield structure is part of the non-conductive frame and wherein forming the second shield structure includes:
- forming a second laser-activated surface structure;
- forming a second base metal disposed on the second laser-activated surface structure;
- and
- forming a second plating metal disposed on the second base metal,
- coupling a baseband circuit card assembly (CCA) to the first shield structure by a first conductive gasket and to the second shield structure by a second conductive gasket;
- coupling a first circuit card assembly (CCA) to the first shield structure by a third conductive gasket;
- and
- coupling a second CCA to the second shield structure by a fourth conductive gasket,
- wherein the baseband CCA is disposed on a bottom side of the non-conductive frame and wherein the first CCA and the second CCA are disposed on a top side of the non-conductive frame, opposite the bottom side,
- wherein the first shield structure is covered with the first base metal and the first plating metal, and
- wherein the first shield structure has a plurality of bumps on at least one surface.
16 more elements
Dependencies are inferred from the claim text.