Shieled enclosure for electronics

The assembly as in claim 9, wherein said cover plate includes outwardly-extending walls, the distal edges of which are covered with said shielding compound, said walls extending outwardly to said circuit board such that said shielding compound along said distal edges is compressed against a surface of said circuit board to provide EMI/RFI shielding between portions of the electronic circuitry on the circuit board.

A process for forming an EMI/RFI shielded cover plate for an electronics enclosure, said cover plate having a major surface and interface locations for sealing against the electronics enclosure and said method comprising the steps of:

• locating said cover plate against a heated mold plate, said mold plate having a surface configuration defining a cavity designed to correspond to desired thickness variations across said major surface and said interface locations of the cover plate,
• introducing between said major surface and said interface location of said cover plate and said surface of said mold plate a shielding compound comprising an elastomer with suspended conductive particles, and
• forming and curing said shielding compound between said cover plate and said mold plate such that said compound fills the cavity between the cover plate and said mold plate and is joined to said major surface and said interface locations of said cover plate in a layer with the desired thickness variation for providing i) EMI/RFI shielding for said major surface area, and ii) resilient, gasket-like response at said interface locations to enable said cover plate to be sealed to the electronics enclosure.

An EMI/RFI shielded cover assembly for an electronics enclosure, said cover assembly comprising a cover plate having a major surface area and interface locations for sealing against the electronics enclosure, and

• a shielding compound disposed in a layer across the major surface area and the interface locations on the cover plate, said shielding compound comprising an elastomer with suspended conductive particles and providing i) EMI/RFI shielding for said major surface area, and ii) resilient, gasket-like response at said interface locations to enable said cover assembly to be sealed to the electronics enclosure.

A method of shielding an electronics enclosure from electromagnetic interference (EMI) and radio frequency interference (RFI) comprising the steps of:

• a) providing a cover plate having a major surface area and interface locations sealable against the electronics enclosure,
• b) disposing a layer of a resilient shielding compound across the major surface area and the interface locations of the cover plate, and
• c) covering the electronics enclosure with the cover plate, said layer of said shielding compound providing EMI/RFI shielding for the major surface area of the cover plate and sealing the interface locations thereof against the electronics enclosure.