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US 2023/0221898 A1Published application
Shield enclosures for memory modules
AssigneeHewlett-Packard Development Company, L.P.
InventorsYing-Chi Chou, Chien Fa Huang, Yi-Feng Lin
Life of this patent
Estimating the term…
Abstract
In example implementations, an apparatus is provided. The apparatus includes a polymer based enclosure, an absorber, and a connection interface. The polymer based enclosure is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board. The absorber is coated over the polymer based enclosure to block radio frequency signals generated by the memory modules. The connection interface is to connect to the memory module connection interface.
Claims20
An apparatus, comprising:
- a polymer based enclosure that is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board;
- an absorber coated over the polymer based enclosure to block radio frequency signals generated by the memory module;
- and
- a connection interface to connect to the memory module connection interface.
1 more element
An apparatus, comprising:
- a polymer based enclosure that is shaped to enclose memory modules connected to a memory module connection interface on a printed circuit board;
- an absorber coated over the polymer based enclosure to block radio frequency signals generated by the memory modules;
- and
- a divider coupled to an inner volume of the polymer based enclosure.
1 more element
A computing device, comprising:
- a plurality of memory modules;
- a memory module connection interface connected to a printed circuit board (PCB), wherein the memory module connection interface comprises a plurality of memory module slots to receive a respective memory module of the plurality of memory modules;
- a wireless communication radio coupled to the PCB;
- and
- a shielding enclosure coupled to the memory module connection interface to enclose the plurality of memory modules and to shield the wireless communication radio from radio frequency noise emitted from the plurality of memory modules.
2 more elements
Dependencies are inferred from the claim text.