H05K 9/0032
Having multiple parts
Official title: {having multiple parts, e.g. frames mating with lids}
H05K9/0032 (Having multiple parts) appears on 467 US grants and 526 published applications in this corpus.
Search patents in H05K- Granted patents
- 467
- Published applications
- 526
- Assignees
- 244
- Inventors
- 1,180
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 5 | 0 |
| 2000 | 10 | 0 |
| 2001 | 16 | 1 |
| 2002 | 11 | 6 |
| 2003 | 7 | 7 |
| 2004 | 5 | 8 |
| 2005 | 7 | 10 |
| 2006 | 9 | 7 |
| 2007 | 6 | 17 |
| 2008 | 7 | 13 |
| 2009 | 16 | 25 |
| 2010 | 8 | 11 |
| 2011 | 17 | 20 |
| 2012 | 6 | 19 |
| 2013 | 13 | 24 |
| 2014 | 9 | 22 |
| 2015 | 13 | 18 |
| 2016 | 14 | 27 |
| 2017 | 22 | 45 |
| 2018 | 30 | 40 |
| 2019 | 40 | 25 |
| 2020 | 35 | 39 |
| 2021 | 24 | 25 |
| 2022 | 22 | 24 |
| 2023 | 21 | 23 |
| 2024 | 19 | 29 |
| 2025 | 26 | 26 |
| 2026 | 14 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for fastening compression-attached memory module to a circuit board29 Sep 2026US 12,750,993 B2Dell Products L. P.
- Nested RF shield system for a tuner circuit8 Sep 2026US 12,733,143 B2Dish Wireless L. L. C.
- Electronic device comprising heat dissipation structure providing heat transfer path18 Aug 2026US 12,713,563 B2Samsung Electronics Co., Ltd.
- Two part external shield for electromagnetic interference reduction18 Aug 2026US 12,713,571 B2STMicroelectronics International N. V.
- Electronic device with improved shielding structure4 Aug 2026US 12,701,686 B2Sony Interactive Entertainment Inc.
- Method of providing intra-module electromagnetic interference shielding to an electronic package module1 Oct 2026US 2026/0304722 A1Skyworks Solutions, Inc.
- Electronic device27 Aug 2026US 2026/0255562 A1Samsung Electronics Co., Ltd.
- Device comprising a shield layer comprising a plurality of openings filled with a thermal interface material20 Aug 2026US 2026/0247591 A1QUALCOMM Incorporated
- Vehicle control device6 Aug 2026US 2026/0231382 A1Astemo, Ltd.
- Shield structure and electronic device6 Aug 2026US 2026/0231383 A1
Most cited
By later US patents
- Circuit board component shielding enclosure and assembly111US 5,354,951 ALeader Tech, Inc. · 1994
- EMI/RFI shielding method and apparatus101US 5,014,160 ADigital Equipment Corporation · 1991
- Electromagnetic shield for printed circuit board88US 4,754,101 AInstrument Specialties Co., Inc. · 1988
- Electronic devices with electromagnetic radiation interference shields and heat sinks88US 5,566,052 ANorthern Telecom Limited · 1996
- Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism84US 5,880,930 ASilicon Graphics, Inc. · 1999