Device comprising a shield layer comprising a plurality of openings filled with a thermal interface material
AssigneeQUALCOMM Incorporated
InventorsYan CAO, Hui HE, Wei TANG, Feihu YE
Life of this patent
Estimating the term…
Abstract
A device comprising a board, an integrated device coupled to the board, a shield frame coupled to the board, a shield layer coupled to the shield frame, wherein the shield layer comprises a first surface, a second surface and a plurality of openings, a thermal interface material coupled to (i) the integrated device and (ii) the shield layer. The thermal interface material is located in the plurality of openings of the shield layer. The thermal interface material touches the integrated device, the first surface of the shield layer and the second surface of the shield layer.
Claims23
A device comprising:
- a board;
- an integrated device coupled to the board;
- a shield frame coupled to the board;
- a shield layer coupled to the shield frame, wherein the shield layer comprises a first surface, a second surface and a plurality of openings;
- and
- a thermal interface material coupled to (i) the integrated device and (ii) the shield layer, wherein the thermal interface material is located in the plurality of openings of the shield layer, and
- wherein the thermal interface material touches the integrated device, the first surface of the shield layer and the second surface of the shield layer.
5-6. (canceled)
(canceled)
A method comprising:
- providing a first shield layer comprising a first surface and a second surface;
- forming a first plurality of openings in the first shield layer;
- coupling a first thermal interface material to the first shield layer such that the first thermal interface material is located in the first plurality of openings of the first shield layer touching (i) the first surface of the first shield layer and (ii) the second surface of the first shield layer;
- and
- coupling the first shield layer to a shield frame, such that the first plurality of openings are located over an integrated device, and wherein the first thermal interface material is coupled to the integrated device.
23-24. (canceled)
Dependencies are inferred from the claim text.