Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism

An electromagnetic interference shielding enclosure with thermal conduction comprising:

• a first housing formed of electrically conductive material, said first housing having a raised surface peripherally surrounding a first enclosure region;
• an integrated circuit device having a top surface and a bottom surface, said integrated circuit device disposed over said first housing such that said integrated circuit device is disposed within said first enclosure region;
• and
• a second housing formed of thermally conductive and electrically conductive material, said second housing having a top surface and a bottom surface, said top surface having extended surfaces extending therefrom, said bottom surface having a raised surface extending therefrom peripherally surrounding a second enclosure region, said second housing disposed over said first housing such that said raised surface of said second housing overlies said raised surface of said first housing so as to form an enclosure therebetween, said raised surface of said second housing electrically coupled to said raised surface of said first housing so as to form an electrically conductive structure around said integrated circuit device such that, upon the operation of said integrated circuit device, radio frequency emissions from said integrated circuit device are shielded by said electrically conductive structure, said integrated circuit device thermally coupled to said second housing such that heat generated by said integrated circuit device is conducted away from said integrated circuit device and is dissipated through said extended surfaces;
• a circuit board electrically coupled to an external power supply and electrically coupled to external devices, said circuit board disposed within said enclosure and electrically coupled to said integrated circuit device such that power may be applied to said integrated circuit device through said circuit board and such that electrical signals may be coupled between said external devices and said integrated circuit device and wherein said circuit board has a top surface and a bottom surface, said top surface including a first conductive grounding strip, said bottom surface having a second conductive ground strip, said circuit board disposed between said second housing and said first housing such that said raised surface of said second housing contacts said first conductive grounding strip and said raised surface of said first housing contacts said second conductive grounding strip so as to electrically connect said second housing and said first housing to an electrical ground.

An electromagnetic interference shield with thermal conduction comprising:

• a first housing formed of electrically conductive material, said first housing connected to an electrical ground;
• a second housing disposed over said first housing so as to form an enclosure therebetween, said second housing formed of thermally conductive and electrically conductive material and connected to an electrical ground, said second housing having a heat conduction and dissipation system thermally coupled thereto;
• a circuit board disposed between said first housing and said second housing, wherein said circuit board has a top surface and a bottom surface, said top surface including a first conductive grounding strip, said bottom surface having a second conductive grounding strip, said circuit board disposed between said second housing and said first housing such that said second housing contacts said first conductive grounding strip and said first housing contacts said second conductive grounding strip so as to electrically connect said second housing and said first housing to an electrical ground;
• an integrated circuit device disposed within said enclosure and thermally coupled to said second housing such that heat generated by said integrated circuit device is conducted away from said integrated circuit device and is dissipated through said heat conduction and dissipation system, said second housing and said first housing absorbing emissions from said integrated circuit device so as to form an electromagnetic interference shield around said integrated circuit device;
• an interconnect socket disposed between said integrated circuit device and said circuit board, said interconnect socket including a plurality of interconnects for electrically coupling said integrated circuit device to said circuit board;
• and
• a compression coupling mechanism for attaching said second housing to said first housing such that pressure is applied between said second housing and said first housing so as to press said integrated circuit device and said interconnect socket against said circuit board so as to electrically couple said integrated circuit device to said circuit board.