H05K 3/287
Photosensitive compositions
Official title: {Photosensitive compositions}
H05K3/287 (Photosensitive compositions) appears on 435 US grants and 407 published applications in this corpus.
Search patents in H05K- Granted patents
- 435
- Published applications
- 407
- Assignees
- 238
- Inventors
- 1,135
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 12 | 0 |
| 1991 | 20 | 0 |
| 1992 | 10 | 0 |
| 1993 | 12 | 0 |
| 1994 | 14 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 11 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 7 | 3 |
| 2002 | 12 | 11 |
| 2003 | 8 | 18 |
| 2004 | 15 | 15 |
| 2005 | 6 | 18 |
| 2006 | 3 | 12 |
| 2007 | 6 | 8 |
| 2008 | 7 | 21 |
| 2009 | 9 | 20 |
| 2010 | 7 | 19 |
| 2011 | 7 | 13 |
| 2012 | 12 | 18 |
| 2013 | 9 | 19 |
| 2014 | 15 | 23 |
| 2015 | 17 | 20 |
| 2016 | 19 | 17 |
| 2017 | 11 | 13 |
| 2018 | 16 | 19 |
| 2019 | 14 | 20 |
| 2020 | 23 | 22 |
| 2021 | 11 | 13 |
| 2022 | 10 | 14 |
| 2023 | 11 | 14 |
| 2024 | 11 | 17 |
| 2025 | 11 | 12 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition, transfer film, cured film, laminate, and method for manufacturing touch panel25 Aug 2026US 12,717,230 B2FUJIFILM Corporation
- Bulb-type light source18 Aug 2026US 12,710,143 B2Seoul Semiconductor Co., Ltd.
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Resin composition for solder resist, solder resist film, and circuit board21 Jul 2026US 12,687,777 B2Sekisui Kasei Co., Ltd.
- Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board14 Jul 2026US 12,681,386 B2Resonac Corporation
- Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same25 Jun 2026US 2026/0182422 A1Qorvo US, Inc.
- Photosensitive element and method for producing circuit board11 Jun 2026US 2026/0161073 A1
- Photosensitive resin film, printed wiring board, and semiconductor package4 Jun 2026US 2026/0153804 A1Resonac Corporation
- Method of producing structure, method of producing interior component, and method of producing electronic device9 Apr 2026US 2026/0101444 A1Alps Alpine Co., Ltd.
- Protection circuit module, method of manufacturing same and secondary battery including same26 Mar 2026US 2026/0088606 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Photoresist composition and printed circuit boards and packages made therewith105US 4,882,245 AInternational Business Machines Corporation · 1989
- Solder resist composition and printed circuit boards97US 6,217,987 B1Ibiden Co., Ltd. · 2001
- Fiber/resin composites, and method of making the same75US 4,892,764 ALoctite Corporation · 1990
- Composition for photo imaging69US 5,300,402 AInternational Business Machines Corporation · 1994
- Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof60US 4,943,516 ATaiyo Ink Manufacturing Co., Ltd. · 1990