Resin composition for solder resist, solder resist film, and circuit board

A resin composition for a solder resist comprising a thermosetting resin, an inorganic filler, and hollow resin particles,

• wherein
• the hollow resin particles comprise at least one selected from hollow resin particles (1) and hollow resin particles (2);
• the hollow resin particles (1) comprise a shell including an aromatic polymer (P1) obtained by polymerizing a monomer composition containing an aromatic crosslinking monomer (a), an aromatic monofunctional monomer (b), and a (meth)acrylic acid ester-based monomer (c) represented by formula (1):
• in which
• R1 represents H or CH3,
• R2 represents H, an alkyl group or a phenyl group,
• R3—O represents an oxyalkylene group having 2 to 18 carbon atoms, and
• m is an average addition molar number of the oxyalkylene group and represents an integer of 2 to 30;
• the hollow resin particles (2) comprise a polymer (P) containing a structural unit (I) derived from a vinyl-based monomer and a structural unit (II) derived from a phosphoric acid ester-based monomer;
• and
• the hollow resin particles are contained in the resin composition for a solder resist in an amount of 1% by weight to 50% by weight with respect to the total solid content of the resin composition for a solder resist.