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AssigneeTaiyo Ink Manufacturing Co., Ltd.
InventorsYuichi Kamayachi, Kenji Sawazaki, Morio Suzuki, Shoji Inagaki
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A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life. By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.
A photosensitive thermosetting-resin composition, comprising (A) a potosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, and (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used.
A method of forming a solder resist pattern on a printed circuit board, which comprises applying on the surface of said printed circuit board a photosensitive thermosetting resin composition comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit threof, (B) a photopolymerization initiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent, as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent, for epoxy resin, exposing the applied layer of said composition selectively to an actinic ray through a photomask having a given pattern, developing the unexposed portion of the applied layer with a developing solution thereby giving rise to a resist pattern, and thereafter thermosetting said finely powdered epoxy compound by application of heat.
Dependencies are inferred from the claim text.