H05K 3/14
Using spraying techniques to apply the conductive material
Official title: using spraying techniques to apply the conductive material {, e.g. vapour evaporation}
H05K3/14 (Using spraying techniques to apply the conductive material) appears on 487 US grants and 474 published applications in this corpus.
Search patents in H05K- Granted patents
- 487
- Published applications
- 474
- Assignees
- 365
- Inventors
- 1,449
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 7 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 4 | 0 |
| 1985 | 10 | 0 |
| 1986 | 4 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 11 | 0 |
| 1990 | 5 | 0 |
| 1991 | 9 | 0 |
| 1992 | 10 | 0 |
| 1993 | 10 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 9 | 0 |
| 2000 | 7 | 0 |
| 2001 | 9 | 5 |
| 2002 | 8 | 6 |
| 2003 | 4 | 5 |
| 2004 | 5 | 6 |
| 2005 | 2 | 12 |
| 2006 | 4 | 14 |
| 2007 | 8 | 18 |
| 2008 | 1 | 16 |
| 2009 | 4 | 12 |
| 2010 | 12 | 18 |
| 2011 | 6 | 10 |
| 2012 | 10 | 6 |
| 2013 | 8 | 21 |
| 2014 | 8 | 19 |
| 2015 | 9 | 35 |
| 2016 | 18 | 27 |
| 2017 | 18 | 27 |
| 2018 | 34 | 32 |
| 2019 | 20 | 33 |
| 2020 | 27 | 25 |
| 2021 | 26 | 24 |
| 2022 | 18 | 21 |
| 2023 | 15 | 20 |
| 2024 | 17 | 30 |
| 2025 | 15 | 19 |
| 2026 | 17 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of fabricating metal mask6 Oct 2026US 12,752,329 B2Darwin Precisions Corporation
- Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness8 Sep 2026US 12,733,110 B2Iee International Electronics & Engineering S.A.
- Conformal power delivery structures including embedded passive devices18 Aug 2026US 12,713,536 B2Intel Corporation
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Wiring substrate4 Aug 2026US 12,702,023 B2Ibiden Co., Ltd.
- Transition from a thin film to a thick film in electrically conducting devices16 Jul 2026US 2026/0206131 A1Dyconex AG
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Superconducting flexible interconnect9 Jul 2026US 2026/0196387 A1All Flex Solutions, Inc.
- Template for metal electrode patterning, stretchable metal electrode using the same and manufacturing method thereof2 Jul 2026US 2026/0185205 A1Seoul National University R&Db Foundation
- Methods for forming seed layer and plasma etching process2 Jul 2026US 2026/0190245 A1Absolics Inc.
Most cited
By later US patents
- Method and apparatus for feeding and coating articles in a controlled atmosphere353US 4,812,217 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998
- Electronic packages and smart structures formed by thermal spray deposition157US 5,278,442 A1994
- Noble metal-polymer composites and flexible thin-film conductors prepared therefrom156US 5,178,957 AMinnesota Mining and Manufacturing Company · 1993
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999