H05K 3/146
By vapour deposition
Official title: {By vapour deposition}
H05K3/146 (By vapour deposition) appears on 147 US grants and 134 published applications in this corpus.
Search patents in H05K- Granted patents
- 147
- Published applications
- 134
- Assignees
- 134
- Inventors
- 493
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 6 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 2 |
| 2004 | 2 | 3 |
| 2005 | 1 | 2 |
| 2006 | 1 | 4 |
| 2007 | 2 | 3 |
| 2008 | 0 | 4 |
| 2009 | 1 | 3 |
| 2010 | 5 | 5 |
| 2011 | 3 | 3 |
| 2012 | 0 | 2 |
| 2013 | 2 | 6 |
| 2014 | 1 | 8 |
| 2015 | 3 | 7 |
| 2016 | 7 | 6 |
| 2017 | 3 | 6 |
| 2018 | 10 | 10 |
| 2019 | 8 | 10 |
| 2020 | 10 | 10 |
| 2021 | 9 | 12 |
| 2022 | 5 | 4 |
| 2023 | 6 | 8 |
| 2024 | 5 | 8 |
| 2025 | 3 | 3 |
| 2026 | 6 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conformal power delivery structures including embedded passive devices18 Aug 2026US 12,713,536 B2Intel Corporation
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Display panel including circuit layer and conductive layer electrically connected to each other through via and method for manufacturing the same, and display apparatus16 Jun 2026US 12,656,839 B2Boe Technology Group Co., Ltd.
- Inductor assembly and manufacturing method for inductor assembly3 Mar 2026US 12,568,586 B2Shennan Circuits Co., Ltd.
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- Superconducting flexible interconnect9 Jul 2026US 2026/0196387 A1All Flex Solutions, Inc.
- Co-jet nozzle assembly and anomaly detection2 Apr 2026US 2026/0092372 A1
- High-Density Multi-Level Interconnects for Harsh Environments and Power Packaging and Method of Making The Same12 Feb 2026US 2026/0047003 A1
- Low-transmission-loss copper-based composite material and preparation method thereof, pcb, and electronic component20 Nov 2025US 2025/0354294 A1Songshan Lake Materials Laboratory
- Chemical vapor deposition method of depositing iridium oxide on neural probe, provided on flexible printed circuit board, using ozone gas25 Sep 2025US 2025/0301577 A1UIF (University Industry Foundation), Yonsei University
Most cited
By later US patents
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000
- Method for making flexible circuit card with laser-contoured vias and machined capacitors109US 5,066,357 AHewlett-Packard Company · 1991
- Method of forming etch mask using particle beam deposition70US 5,382,315 AMicroelectronics and Computer Technology Corporation · 1995
- Insulating film, sheet, or plate material with metallic coating and method for manufacturing same67US 4,091,138 ASumitomo Bakelite Co., Ltd. · 1978