Display panel including circuit layer and conductive layer electrically connected to each other through via and method for manufacturing the same, and display apparatus

A method for manufacturing a display apparatus, the method comprising:

• forming a display panel;
• and
• forming a circuit structure located outside the display panel;
• wherein forming the display panel, comprises:
• forming a flexible base on a substrate;
• forming a circuit layer on the flexible base, wherein the circuit layer is configured to be bonded to the circuit structure;
• forming an insulating layer covering the circuit layer, wherein the insulating layer includes a barrier layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, and an interlayer dielectric layer that are sequentially stacked on the circuit layer, and the insulating layer has at least one via exposing the circuit layer;
• forming a conductive layer on the insulating layer, wherein the conductive layer is electrically connected to the circuit layer through the at least one via, the conductive layer includes three sub-layers that are stacked, a material of an intermediate sub-layer among the three sub-layers includes aluminum, a material of other two sub-layers is titanium, the conductive layer is configured such that electrical signals are transmitted between the conductive layer and the circuit layer, the display panel has a display area and a non-display area, the circuit layer is provided between the flexible base and the insulating layer, the circuit layer and the conductive layer are both located within the display area, orthographic projections of the circuit layer, the insulating layer, and the conductive layer on the flexible base have an overlapping region, and an orthogonal projection of the at least one via on the flexible base is located within the overlapping region within the display area, and the circuit layer includes a chip;
• and
• after forming the circuit layer on the flexible base, forming the display panel further comprises:
• forming at least one opening in the flexible base, the at least one opening exposing at least one partial region of the circuit layer, the at least one opening receiving a part of the circuit structure, and the part of the circuit structure being disposed in the at least one opening;
• wherein the conductive layer includes a portion directly extending into the at least one via, covering a side wall of the at least one via and contacting a partial surface of the circuit layer proximate to the insulating layer, wherein the portion of the conductive layer is recessed towards the circuit layer to form an inverted trapezoidal recess;
• the conductive layer and the circuit layer are electrically connected through surfaces that are in contact with each other.