Low-transmission-loss copper-based composite material and preparation method thereof, pcb, and electronic component

Abstract

The present disclosure relates to the technical field of composite materials, in particular, to a low-transmission-loss copper-based composite material and a preparation method thereof, a PCB, and an electronic component. The low-transmission-loss copper-based composite material comprises: a plurality of lamination units repeatedly stacked in sequence along a preset direction, each lamination unit comprising a conductor layer and an insulation layer covering a surface of the conductor layer along the preset direction, and wherein the conductor layer comprises a single-crystal copper layer. The low-transmission-loss copper-based composite material provided in the present disclosure can effectively increase the effective area for signal transmission of the low-transmission-loss copper-based composite material, and can effectively reduce the transmission loss of the entire low-transmission-loss copper-based composite material without reducing the surface roughness of the single-crystal copper layer, which facilitates the application of the low-transmission-loss copper-based composite material in high-frequency high-speed signal transmission.

Dependencies are inferred from the claim text.