Conformal power delivery structures including embedded passive devices

A microelectronic system including:

• a package substrate;
• a die electrically and mechanically coupled to the package substrate;
• an embedded passive structure attached to the package substrate and including:
• a passive device;
• a first power plane comprising metal and having a portion electrically coupled to a terminal of the passive device, wherein an upper surface of a combination of the first power plane and the passive device defines a recess;
• a second power plane on the first power plane and comprising metal, the second power plane at least partially within the recess and having a lower surface that conforms with the upper surface of the combination, wherein the second power plane has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another;
• and
• a liner including a dielectric layer, the liner on the first power plane, on the passive device, and between the first power plane and the second power plane, the liner further partially within the recess.

An electrical system including:

• one or more processing units;
• a memory coupled to the one or more processing units;
• and
• a microelectronic system coupled to the one or more processing units, and including:
• a package substrate;
• a die electrically and mechanically coupled to the package substrate;
• an embedded passive structure attached to the package substrate and including:
• a passive device;
• a first power plane comprising metal and having a portion electrically coupled to a terminal of the passive device, wherein an upper surface of a combination of the first power plane and the passive device defines a recess;
• a second power plane on the first power plane and comprising metal, the second power plane at least partially within the recess and having a lower surface that conforms with the upper surface of the combination, wherein the second power plane has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another;
• and
• a liner including a dielectric layer, the liner on the first power plane, on the passive device, and between the first power plane and the second power plane, the liner further partially within the recess.