H05K 3/143
Masks therefor
Official title: {Masks therefor (H05K3/048 takes precedence)}
H05K3/143 (Masks therefor) appears on 145 US grants and 96 published applications in this corpus.
Search patents in H05K- Granted patents
- 145
- Published applications
- 96
- Assignees
- 101
- Inventors
- 336
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 2 |
| 2003 | 1 | 3 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 6 |
| 2007 | 4 | 7 |
| 2008 | 1 | 6 |
| 2009 | 1 | 3 |
| 2010 | 3 | 5 |
| 2011 | 0 | 1 |
| 2012 | 5 | 0 |
| 2013 | 1 | 3 |
| 2014 | 2 | 1 |
| 2015 | 0 | 5 |
| 2016 | 5 | 4 |
| 2017 | 1 | 5 |
| 2018 | 2 | 4 |
| 2019 | 4 | 5 |
| 2020 | 3 | 8 |
| 2021 | 7 | 5 |
| 2022 | 5 | 4 |
| 2023 | 3 | 5 |
| 2024 | 2 | 2 |
| 2025 | 2 | 7 |
| 2026 | 4 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of fabricating metal mask6 Oct 2026US 12,752,329 B2Darwin Precisions Corporation
- Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness8 Sep 2026US 12,733,110 B2Iee International Electronics & Engineering S.A.
- Inductor assembly and manufacturing method for inductor assembly3 Mar 2026US 12,568,586 B2Shennan Circuits Co., Ltd.
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- Printed wiring board4 Dec 2025US 2025/0374425 A1Ibiden Co., Ltd.
- Method of Furnishing Three-Dimensional Objects with Electrically Conductive Structures having Low Topography and Low Surface Roughness20 Nov 2025US 2025/0358938 A1Iee International Electronics & Engineering S.A.
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
- High Density Electrode Mapping Catheter21 Aug 2025US 2025/0261892 A1St. Jude Medical, Cardiology Division, Inc.
- Method for producing selectively metallised three-dimensional items with a masking coating composition5 Jun 2025US 2025/0178267 A1Jet Metal Technologies
Most cited
By later US patents
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Microbump interconnect for semiconductor dice72US 6,127,736 AMicron Technology, Inc. · 2000
- Method of forming etch mask using particle beam deposition70US 5,382,315 AMicroelectronics and Computer Technology Corporation · 1995
- Integrated fabrication method of forming connectors through insulative layers61US 4,076,575 AInternational Business Machines Corporation · 1978