H05K 3/16
By cathodic sputtering
Official title: by cathodic sputtering
H05K3/16 (By cathodic sputtering) appears on 130 US grants and 156 published applications in this corpus.
Search patents in H05K- Granted patents
- 130
- Published applications
- 156
- Assignees
- 109
- Inventors
- 440
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 2 |
| 2003 | 0 | 1 |
| 2004 | 2 | 3 |
| 2005 | 0 | 2 |
| 2006 | 0 | 3 |
| 2007 | 3 | 7 |
| 2008 | 0 | 4 |
| 2009 | 2 | 4 |
| 2010 | 2 | 7 |
| 2011 | 2 | 1 |
| 2012 | 4 | 1 |
| 2013 | 3 | 9 |
| 2014 | 2 | 4 |
| 2015 | 3 | 15 |
| 2016 | 8 | 8 |
| 2017 | 7 | 8 |
| 2018 | 13 | 12 |
| 2019 | 6 | 10 |
| 2020 | 11 | 5 |
| 2021 | 9 | 4 |
| 2022 | 5 | 9 |
| 2023 | 5 | 6 |
| 2024 | 4 | 18 |
| 2025 | 8 | 7 |
| 2026 | 7 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Wiring substrate4 Aug 2026US 12,702,023 B2Ibiden Co., Ltd.
- Wiring substrate28 Jul 2026US 12,696,392 B2Ibiden Co., Ltd.
- Printed wiring board2 Jun 2026US 12,648,081 B2Ibiden Co., Ltd.
- Inductor assembly and manufacturing method for inductor assembly3 Mar 2026US 12,568,586 B2Shennan Circuits Co., Ltd.
- Transition from a thin film to a thick film in electrically conducting devices16 Jul 2026US 2026/0206131 A1Dyconex AG
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Methods for forming seed layer and plasma etching process2 Jul 2026US 2026/0190245 A1Absolics Inc.
- Method of manufacturing flexible copper clad laminated film having ptfe substrate25 Jun 2026US 2026/0176743 A1Cit, S.A.
- Printed wiring board30 Apr 2026US 2026/0122793 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Method and apparatus for feeding and coating articles in a controlled atmosphere353US 4,812,217 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Multilayered intermetallic connection for semiconductor devices74US 5,071,714 AInternational Business Machines Corporation · 1991
- Multichip module and integrated circuit substrates having planarized patterned surfaces56US 5,187,119 AThe Boeing Company · 1993
- Process for creating organic polymeric substrate with copper53US 5,372,848 AInternational Business Machines Corporation · 1994
- Method of electrically interconnecting circuit assemblies39US 10,264,664 B1VLT, Inc. · 2019