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US 5,372,848 AGranted
Process for creating organic polymeric substrate with copper
AssigneeInternational Business Machines Corporation
InventorsKim J. Blackwell, Luis J. Matienzo, Allan R. Knoll
Life of this patent
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Abstract
A copper layer is coated onto an organic polymeric substrate in the presence of a gas containing nitrogen and a noble gas.
Claims21
A method for depositing copper onto an organic polymer substrate and for improving the adhesion of the copper on the organic polymeric substrate which comprises providing an organic polymer substrate;
- coating onto said organic polymeric substrate a layer of copper by sputtering or evaporation in the presence of a gas containing nitrogen and a noble gas, wherein the volume percentage of nitrogen in said gas is about 0.09 to about 50%.
Dependencies are inferred from the claim text.