H05K 3/107
By filling grooves in the support with conductive material
Official title: {by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence)}
H05K3/107 (By filling grooves in the support with conductive material) appears on 766 US grants and 915 published applications in this corpus.
Search patents in H05K- Granted patents
- 766
- Published applications
- 915
- Assignees
- 413
- Inventors
- 1,905
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 6 | 0 |
| 1983 | 8 | 0 |
| 1984 | 3 | 0 |
| 1985 | 15 | 0 |
| 1986 | 5 | 0 |
| 1987 | 6 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 12 | 0 |
| 1992 | 12 | 0 |
| 1993 | 11 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 15 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 2 |
| 2002 | 7 | 16 |
| 2003 | 9 | 21 |
| 2004 | 16 | 43 |
| 2005 | 22 | 86 |
| 2006 | 23 | 41 |
| 2007 | 35 | 57 |
| 2008 | 29 | 60 |
| 2009 | 18 | 56 |
| 2010 | 38 | 47 |
| 2011 | 28 | 35 |
| 2012 | 45 | 43 |
| 2013 | 29 | 27 |
| 2014 | 23 | 54 |
| 2015 | 31 | 48 |
| 2016 | 39 | 24 |
| 2017 | 27 | 27 |
| 2018 | 20 | 20 |
| 2019 | 16 | 27 |
| 2020 | 25 | 31 |
| 2021 | 20 | 27 |
| 2022 | 26 | 27 |
| 2023 | 18 | 27 |
| 2024 | 25 | 29 |
| 2025 | 18 | 13 |
| 2026 | 10 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Component Carrier and a Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304611 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Forming a circuit bearing structure with particle-free metal ink1 Oct 2026US 2026/0304645 A1LCP Medical Technologies, Inc.
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- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias406US 4,789,648 AInternational Business Machines Corporation · 1988
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010
- Integrated circuit substrate having laser-embedded conductive patterns and method therefor204US 6,930,256 B1Amkor Technology, Inc. · 2005
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992