H05K 2203/107
Using laser light
H05K2203/107 (Using laser light) appears on 1,397 US grants and 1,535 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,397
- Published applications
- 1,535
- Assignees
- 737
- Inventors
- 3,729
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 8 | 0 |
| 1986 | 8 | 0 |
| 1987 | 14 | 0 |
| 1988 | 11 | 0 |
| 1989 | 20 | 0 |
| 1990 | 16 | 0 |
| 1991 | 20 | 0 |
| 1992 | 26 | 0 |
| 1993 | 30 | 0 |
| 1994 | 27 | 0 |
| 1995 | 21 | 0 |
| 1996 | 19 | 0 |
| 1997 | 22 | 0 |
| 1998 | 20 | 0 |
| 1999 | 13 | 0 |
| 2000 | 20 | 0 |
| 2001 | 25 | 16 |
| 2002 | 27 | 33 |
| 2003 | 34 | 34 |
| 2004 | 32 | 38 |
| 2005 | 24 | 64 |
| 2006 | 37 | 47 |
| 2007 | 21 | 55 |
| 2008 | 16 | 48 |
| 2009 | 21 | 62 |
| 2010 | 43 | 50 |
| 2011 | 25 | 32 |
| 2012 | 32 | 47 |
| 2013 | 28 | 43 |
| 2014 | 31 | 75 |
| 2015 | 42 | 80 |
| 2016 | 41 | 67 |
| 2017 | 55 | 85 |
| 2018 | 58 | 89 |
| 2019 | 81 | 95 |
| 2020 | 89 | 88 |
| 2021 | 77 | 77 |
| 2022 | 57 | 54 |
| 2023 | 55 | 63 |
| 2024 | 45 | 86 |
| 2025 | 58 | 56 |
| 2026 | 25 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device and manufacturing method thereof8 Sep 2026US 12,733,523 B2Innolux Corporation
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Wave soldering device, manufacturing method thereof and printed circuit board14 Jul 2026US 12,684,701 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Method for manufacturing wiring board14 Jul 2026US 12,685,183 B2Toppan Inc.
- Highly integrated power electronics and methods of manufacturing the same23 Jun 2026US 12,666,545 B2Toyota Motor Engineering & Manufacturing North America, Inc.
- Method for manufacturing circuit board and circuit board8 Oct 2026US 2026/0313796 A1Resonac Corporation
- Component Carrier and a Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304611 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Conductive substrate and manufacturing method thereof1 Oct 2026US 2026/0304616 A1DeepWave, Inc.
- Interconnect substrate and method of making same17 Sep 2026US 2026/0282212 A1Shinko Electric Industries Co., Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
Most cited
By later US patents
- Laser system and method for single press micromachining of multilayer workpieces267US 6,407,363 B2Electro Scientific Industries, Inc. · 2002
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Precision spray processes for direct write electronic components212US 6,251,488 B1Optomec Design Company · 2001
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992