H05K 2203/054
Continuous temporary metal layer over resist
Official title: Continuous temporary metal layer over resist, e.g. for selective electroplating
H05K2203/054 (Continuous temporary metal layer over resist) appears on 123 US grants and 150 published applications in this corpus.
Search patents in H05K- Granted patents
- 123
- Published applications
- 150
- Assignees
- 62
- Inventors
- 275
- Latest grant
- 29 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 2 |
| 2003 | 6 | 5 |
| 2004 | 3 | 8 |
| 2005 | 4 | 12 |
| 2006 | 7 | 17 |
| 2007 | 4 | 14 |
| 2008 | 11 | 14 |
| 2009 | 4 | 11 |
| 2010 | 8 | 15 |
| 2011 | 9 | 10 |
| 2012 | 8 | 8 |
| 2013 | 8 | 5 |
| 2014 | 5 | 4 |
| 2015 | 1 | 3 |
| 2016 | 3 | 2 |
| 2017 | 2 | 2 |
| 2018 | 1 | 2 |
| 2019 | 0 | 3 |
| 2020 | 2 | 1 |
| 2021 | 0 | 3 |
| 2022 | 2 | 3 |
| 2023 | 2 | 2 |
| 2024 | 3 | 2 |
| 2025 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Circuit structure and fabrication method thereof29 Oct 2024US 12,133,337 B2Innolux Corporation
- Circuit board and manufacturing method thereof25 Jun 2024US 12,022,612 B2Unimicron Technology Corp.
- Multilayer wiring board and method of producing the same27 Feb 2024US 11,917,751 B2Toppan Inc.
- Printed wiring board and method for manufacturing the same15 Aug 2023US 11,729,911 B2Ibiden Co., Ltd.
- Method for optimized filling hole and manufacturing fine line on printed circuit board15 Aug 2023US 11,729,917 B2Triallian Corporation
- Ceramic substrate, light-emitting device, and methods of manufacturing ceramic substrate and light-emitting device30 Oct 2025US 2025/0338696 A1Nichia Corporation
- Circuit structure16 Jan 2025US 2025/0024608 A1Innolux Corporation
- Printed circuit board27 Jun 2024US 2024/0215157 A1Samsung Electro-Mechanics Co., Ltd.
- Electronic devices and manufacturing method thereof6 Jun 2024US 2024/0186476 A1Innolux Corporation
- Package structure and method for manufacturing package structure28 Dec 2023US 2023/0420343 A1Changxin Memory Technologies, Inc.
Most cited
By later US patents
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Encapsulated circuitized power core alignment and lamination149US 5,229,550 AInternational Business Machines Corporation · 1993
- Applying solder to high density substrates139US 5,316,788 AInternational Business Machines Corporation · 1994
- Fine pitch bumping with improved device standoff and bump volume101US 6,372,622 B1Motorola, Inc. · 2002