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US 2025/0024608 A1Published application
Circuit structure
AssigneeInnolux Corporation
InventorsYi Hung Lin, Li-Wei Sung
Life of this patent
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Abstract
A circuit structure is provided. The circuit structure includes an insulating layer, a conductive pad and a solder pad. The insulating layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed on the first surface of the insulating layer. The solder pad is disposed on the second surface of the insulating layer. The solder pad is coupled to the conductive pad. The insulating layer has a recess region on the second surface.
Claims10
A circuit structure, comprising:
- an insulating layer, having a first surface, a second surface opposite to the first surface;
- a conductive pad, disposed on the first surface of the insulating layer;
- and
- a solder pad, disposed on the second surface of the insulating layer, wherein the solder pad is coupled to the conductive pad, and the insulating layer has a recess region on the second surface.
1 more element
Dependencies are inferred from the claim text.