Electronic devices and manufacturing method thereof

A manufacturing method of an electronic device, comprising:

• providing a first substrate, wherein the first substrate comprises a first surface, a second surface, and a side surface, the first surface is opposite to the second surface, and the side surface is between the first surface and the second surface;
• forming a first conductive pattern on the first surface of the first substrate;
• forming a first protective film on the first conductive pattern, wherein an edge of the first protective film has at least one concave portion and at least one convex portion adjacent to the at least one concave portion on the first surface;
• forming a conductive layer on the side surface and the first surface;
• removing the first protective film;
• and
• patterning the conductive layer to form a side conductive pattern connected to the first conductive pattern.

An electronic device, comprising:

• a first substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface;
• a first conductive pattern disposed on the first surface;
• and
• a side conductive pattern disposed on the side surface, wherein the side conductive pattern is electrically connected to the first conductive pattern, and the side conductive pattern comprises a first side conductive line,
• wherein the first conductive pattern covers a portion of the first side conductive line.