H05K 2201/09627
Special connections between adjacent vias, not for grounding vias
H05K2201/09627 (Special connections between adjacent vias, not for grounding vias) appears on 313 US grants and 335 published applications in this corpus.
Search patents in H05K- Granted patents
- 313
- Published applications
- 335
- Assignees
- 182
- Inventors
- 769
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 6 |
| 2002 | 14 | 5 |
| 2003 | 10 | 5 |
| 2004 | 7 | 27 |
| 2005 | 7 | 11 |
| 2006 | 21 | 32 |
| 2007 | 12 | 18 |
| 2008 | 21 | 44 |
| 2009 | 21 | 23 |
| 2010 | 16 | 40 |
| 2011 | 25 | 24 |
| 2012 | 30 | 4 |
| 2013 | 17 | 4 |
| 2014 | 11 | 7 |
| 2015 | 8 | 9 |
| 2016 | 6 | 7 |
| 2017 | 7 | 4 |
| 2018 | 5 | 4 |
| 2019 | 9 | 6 |
| 2020 | 5 | 10 |
| 2021 | 5 | 7 |
| 2022 | 5 | 7 |
| 2023 | 7 | 8 |
| 2024 | 4 | 7 |
| 2025 | 5 | 9 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Circuit board arrangement comprising a circuit board provided with a graphene island and method of communicating between a first and a second circuit24 Mar 2026US 12,588,141 B2Telefonaktiebolaget Ericsson LM (publ)
- Electronic device including wire16 Apr 2026US 2026/0106925 A1Samsung Electronics Co., Ltd.
- Power supply module and electronic device16 Apr 2026US 2026/0107374 A1Delta Electronics (Shanghai) Co., Ltd.
- Manufacturing method for a circuit board and circuit board2 Apr 2026US 2026/0096019 A1JCET Management Co., Ltd.
- High-density decoupling capacitor routing optimizing capacitance with consideration for high-yield manufacturing19 Mar 2026US 2026/0082484 A1Nokia Solutions and Networks Oy
- Vertical power supply system and manufacturing method of connection board12 Mar 2026US 2026/0075702 A1Delta Electronics (Shanghai) Co., Ltd.
Most cited
By later US patents
- Method for reducing via inductance in an electronic assembly and article190US 6,021,564 AW. L. Gore & Associates, Inc. · 2000
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- Fine dimension stacked vias for a multiple layer circuit board structure119US 5,699,613 AInternational Business Machines Corporation · 1997
- Midplane configuration featuring surface contact connectors95US 6,528,737 B1Nortel Networks Limited · 2003
- Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias90US 5,758,413 AInternational Business Machines Corporation · 1998