H05K 2201/09609
Via grid, i.e. two-dimensional array of vias or holes in a single
Official title: Via grid, i.e. two-dimensional array of vias or holes in a single plane
H05K2201/09609 (Via grid, i.e. two-dimensional array of vias or holes in a single) appears on 382 US grants and 431 published applications in this corpus.
Search patents in H05K- Granted patents
- 382
- Published applications
- 431
- Assignees
- 249
- Inventors
- 1,129
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 8 |
| 2002 | 5 | 9 |
| 2003 | 7 | 9 |
| 2004 | 9 | 11 |
| 2005 | 6 | 11 |
| 2006 | 10 | 8 |
| 2007 | 9 | 14 |
| 2008 | 10 | 11 |
| 2009 | 8 | 10 |
| 2010 | 5 | 11 |
| 2011 | 9 | 11 |
| 2012 | 9 | 12 |
| 2013 | 10 | 8 |
| 2014 | 6 | 10 |
| 2015 | 2 | 7 |
| 2016 | 9 | 18 |
| 2017 | 13 | 12 |
| 2018 | 14 | 26 |
| 2019 | 20 | 25 |
| 2020 | 38 | 44 |
| 2021 | 36 | 36 |
| 2022 | 31 | 26 |
| 2023 | 25 | 27 |
| 2024 | 15 | 22 |
| 2025 | 20 | 19 |
| 2026 | 12 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device30 Jun 2026US 12,671,160 B2Murata Manufacturing Co., Ltd.
- High-frequency module and communication device19 May 2026US 12,633,956 B2Murata Manufacturing Co., Ltd.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Circuit board device24 Sep 2026US 2026/0292971 A1Global Unichip Corporation
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Electronic module and electronic device6 Aug 2026US 2026/0231320 A1Canon Kabushiki Kaisha
- Printed circuit board (pcb) miniaturization by an embedded via-in-via design30 Jul 2026US 2026/0223279 A1Google Inc.
Most cited
By later US patents
- Multi-layer circuit construction methods with customization features158US 5,282,312 ATessera, Inc. · 1994
- Circuit boards containing vias and methods for producing same112US 6,797,616 B2Micron Technology, Inc. · 2004
- Circuit boards containing vias and methods for producing same111US 6,774,486 B2Micron Technology, Inc. · 2004
- Method of making a multi-layer circuit assembly91US 5,367,764 ATessera, Inc. · 1994
- Printed circuit board and method of reducing crosstalk in a printed circuit board85US 7,239,526 B1Xilinx, Inc. · 2007